Aluminum nitride has good corrosion resistance to Al and other molten metals, gallium arsenide, etc., especially to molten Al liquid, and has excellent electrical insulation and dielectric properties.
However, aluminum nitride has poor high-temperature oxidation resistance. It easily absorbs moisture and hydrolyzes in the atmosphere. It generates heat and nitrogen and rapidly decomposes when it comes into contact with humid air, water or aqueous liquids. It decomposes at 2516°C, has a very high thermal hardness, and does not soften or deform even before the decomposition temperature. Aluminum nitride and water can also react slowly at room temperature and be hydrolyzed. React with dry oxygen at temperatures above 800°C.
1. Aluminum nitride ceramic is a new type of high-tech ceramic. Aluminum nitride substrate has the characteristics of extremely high thermal conductivity, corrosion resistance, high temperature resistance, and good thermochemical stability. It is an ideal packaging material, heat dissipation material, circuit component and other materials for large-scale integrated circuits, semiconductor module circuits and high-power devices. Interconnect line carrier. It is also an additive to improve the thermal conductivity and mechanical properties of polymer materials. Aluminum nitride ceramics can also be used as crucibles for melting non-ferrous metals and semiconductor materials gallium arsenide, protective tubes for thermocouples, high-temperature insulation parts, microwave dielectric materials, High temperature resistant and corrosion resistant structural ceramics and transparent aluminum nitride microwave ceramic products are used as raw materials for the production of high thermal conductivity ceramics and resin fillers. Aluminum nitride is an electrical insulator with good dielectric properties. The aluminum nitride coating on the surface of gallium arsenide protects it from ion implantation during annealing.
2. Used as raw materials for the production of high thermal conductivity ceramics, raw materials for AlN ceramic substrates, resin fillers, etc.
