Using cathodic arc plasma deposition technology. Cathodic arc plasma deposition is a relatively new thin film deposition technology that is similar in many ways to ion plating. Its advantages: high ionization rate in the emitted particle flow, and these ionized ions have high kinetic energy (40-100eV).
Many of the advantages of ion beam deposition, such as improved adhesion, increased density of states, and high reactivity to compound film formation, are all reflected in cathodic arc plasma deposition. Cathodic arc plasma deposition has its own unique advantages, such as being able to deposit on more complex-shaped substrates, with high deposition rate, good coating uniformity, low substrate temperature, and easy preparation of compounds or alloys with ideal chemical ratios. .
The cathode material is evaporated by the evaporation process due to high current density, and the resulting evaporate is composed of electrons, ions, central gas phase atoms and particles. At the cathode arc point, the material is ionized almost immediately. The ions are emitted in a direction almost perpendicular to the cathode surface. When the high-energy chromium ions hit the nitrogen, they will immediately undergo a chemical reaction and become gaseous. Chromium nitride molecules.
